High ThRoughput lasEr texturing of Self-CLEANing and antibacterial surfaces
Call: H2020-ICT-2015
Start Date: 01/04/2016
Duration: 43 months
Area: Photonics

The TresClean Project will develop high-throughput laser-based texturing for fluid-repellent and antibacterial metal surfaces using innovative industrial high-average power ultrashort-pulsed lasers in combination with high-performance scanning heads. These technologies will be applied to produce self-cleaning and aseptic machine parts for food industry (e.g. components in contact with biological foods) and home appliances (e.g. dishwashers) by utilising a beam deliverary method over areas that can reach 250mm2.

The Aim

The aim of TresClean is to demonstrate high-throughput laser-based manufacturing applied to the production of plastic and metal component parts of consumer white goods and liquid filling machines respectively through the development of a novel industrial use of high-average power pulsed lasers in combination with high-performance optical devices and beam delivery systems.

The Objectives

To master and control the upscaling of productivity for anti-microbial surfaces obtained by laser processing.

  • Development of surface topographies with fluid repellent and antibacterial properties over large areas (>500cm² for food industry, >5000cm² home appliance)

  • High throughput processing technologies for functional surfaces (DLIP and LIPPS) with USP laser sources with an overall structuring rate of up to 40mm²/s.

  • High average power ultra-short pulsed laser systems at 1030 nm wavelength integrated with fast synchronisation to scanner technology:

  • High pulse energy (3.3 mJ), low repetition rate (300 kHz) up to 1kW average power with up to 45% of optical efficiency

  • Low pulse energy (50 μJ), high repetition rate (10MHz) up to 500W average power

  • High efficiency frequency conversion (Second Harmonic Generation and Third Harmonic Generation) for shorter wavelengths (515nm, 343nm) with average output power of 500W @515nm and 100W@343nm
  • Fast scanning technology for beam movement (200 m/s) and high throughput production to support lasers up to 20 MHz with high average power up to 1kW.

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