“The targeted applications address global market needs and will support mainstream adoption of AM processes in EU industry by displacing existing processes with smart, flexible, digitally enabled manufacturing technology. HiperLAM business cases promise significant revenue growth in both application spaces and in the potential for consortium partners to establish themselves in pre-eminent positions in high resolution, low cost, high throughput AM technology.”
The HiperLAM Project is an initiative of the Photonics and Factories of the Future Public Private Partnerships and received funding from the European Union's Horizon 2020 Research and Innovation Programme under Grant Agreement No. 723879.
The Project is focused upon demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing in two key applications requiring high resolution printed conductive metallic lines, namely on-chip RFID Antenna and Fingerprint sensors.